Title :
Several reliability related issues for flip-chip packaging
Author :
Liu, Sheng ; Wang, Jianjun ; Qian, Zhengfang
Author_Institution :
Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA
Abstract :
In this paper, several reliability-related mechanics problems in flip-chip packages are discussed. These problems include failure modes (cracking and delamination) and prevention, underfill selection and design, board design effect of processing induced defects (settling effect, incomplete fill, debonding), ball pitch effect, solder joint fatigue, and reliability of conductive epoxy
Keywords :
flip-chip devices; integrated circuit packaging; integrated circuit reliability; ball pitch effect; board design; conductive epoxy; cracking; debonding; delamination; fatigue; flip-chip packaging; mechanics; processing defects; reliability; settling effect; solder joint fatigue; thermomechanical failure; underfill; Ceramics; Costs; Delamination; Electronics packaging; Fatigue; Moisture; Passivation; Plastic packaging; Silicon; Thermal stresses;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-4306-9
DOI :
10.1109/ICSICT.1998.785943
