Title :
Steam-age preconditioning and NiPd finished IC packages
Author :
Abbott, Donald C. ; Romm, D.W.
Author_Institution :
Texas Instrum. Inc., USA
Abstract :
Removal of lead (Pb) from finished integrated circuit (IC) packages is an ongoing effort by many manufacturers. To this end, the semiconductor industry is converting to nickel/palladium (NiPd) finished leadframes for assembly of ICs. This technology eliminates Pb from the IC package. Historically, users of IC components have used steam-aging to simulate accelerated aging of devices, to accentuate lead finish defects, and to provide a “guard band” of performance for leadframe and IC device inspection. Steam-age preconditioning of IC leads is well established for solderability testing of tin/lead (SnPb) finished leads. In this study, the solderability of NiPd plated leads after steam-aging is compared to that after shelf storage. This study was carried out to determine the relevance of steam-age preconditioning for NiPd finished leads
Keywords :
ageing; coatings; integrated circuit bonding; integrated circuit packaging; lead bonding; nickel alloys; palladium alloys; soldering; wetting; IC leads; NiPd; NiPd finished IC packages; NiPd plated leads; accelerated aging simulation; lead solderability; leadframes; shelf storage; steam-age preconditioning; Assembly; Components, packaging, and manufacturing technology; Electronics industry; Integrated circuit manufacture; Integrated circuit packaging; Lead compounds; Nickel; Palladium; Semiconductor device manufacture; Semiconductor device packaging;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-4306-9
DOI :
10.1109/ICSICT.1998.785944
