Steam-age preconditioning and NiPd finished IC packages

Removal of lead (Pb) from finished integrated circuit (IC) packages is an ongoing effort by many manufacturers. To this end, the semiconductor industry is converting to nickel/palladium (NiPd) finished leadframes for assembly of ICs. This technology eliminates Pb from the IC package. Historically, users of IC components have used steam-aging to simulate accelerated aging of devices, to accentuate lead finish defects, and to provide a “guard band” of performance for leadframe and IC device inspection. Steam-age preconditioning of IC leads is well established for solderability testing of tin/lead (SnPb) finished leads. In this study, the solderability of NiPd plated leads after steam-aging is compared to that after shelf storage. This study was carried out to determine the relevance of steam-age preconditioning for NiPd finished leads