Title :
Optimization of design and manufacturing parameters for solder joint geometry and self-alignment in flip-chip technology
Author :
Zhu, Qinong ; Wang, Guozhong ; Luo, Le
Author_Institution :
Inst. of Metall., Acad. Sinica, Shanghai, China
Abstract :
The solder joint reliability and self-alignment of flip-chip technology depend on the parameters of design and the manufacturing process, and eventually the solder joint geometry. In this paper, a numerical simulation method along with the Surface Evolver program has been proposed for solder joint geometry and self-alignment of bumped chips in flip-chip technology. The influences of the parameters in the designing and manufacturing process on solder joint geometry and self-alignment are investigated. An estimation of the optimal windows for design and process parameters is established
Keywords :
assembling; digital simulation; electronic engineering computing; flip-chip devices; numerical analysis; optimisation; printed circuit manufacture; soldering; PCB assembly; Surface Evolver program; bumped chips; design optimization; flip-chip technology; manufacturing parameters; numerical simulation method; solder joint geometry; solder joint reliability; solder joint self-alignment; Chip scale packaging; Design optimization; Electronics packaging; Flip chip; Flip chip solder joints; Geometry; Manufacturing processes; Process design; Soldering; Solid modeling;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-4306-9
DOI :
10.1109/ICSICT.1998.785946
