• DocumentCode
    3066676
  • Title

    Practical resolution limit of KrF lithography

  • Author

    Schuster, Ralf

  • Author_Institution
    Semicond. Res. & Dev. Center, IBM Corp., Hopewell Junction, NY, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    123
  • Lastpage
    126
  • Abstract
    Since lithography represents a major part of chip manufacturing costs it is desirable to extend KrF optical lithography to 0.15 μm design rules and beyond. This paper discusses the resolution limits that can be achieved with state-of-the-art 0.68 NA exposure systems and optical enhancement techniques such as modified illumination, phase shift masks and optical proximity corrections. The goal is to optimize the imaging process to achieve process windows large enough for use in a manufacturing environment
  • Keywords
    phase shifting masks; proximity effect (lithography); ultraviolet lithography; 0.15 micron; DUV lithography; KrF; KrF excimer laser; chip manufacturing; exposure system; imaging process optimization; off-axis illumination; optical proximity correction; phase shift mask; process window; resolution enhancement technique; semiconductor technology; Apertures; Costs; Focusing; Lenses; Lighting; Lithography; Optical attenuators; Optical imaging; Resists; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems, and Applications, 1999. International Symposium on
  • Conference_Location
    Taipei
  • ISSN
    1524-766X
  • Print_ISBN
    0-7803-5620-9
  • Type

    conf

  • DOI
    10.1109/VTSA.1999.786016
  • Filename
    786016