DocumentCode
3066676
Title
Practical resolution limit of KrF lithography
Author
Schuster, Ralf
Author_Institution
Semicond. Res. & Dev. Center, IBM Corp., Hopewell Junction, NY, USA
fYear
1999
fDate
1999
Firstpage
123
Lastpage
126
Abstract
Since lithography represents a major part of chip manufacturing costs it is desirable to extend KrF optical lithography to 0.15 μm design rules and beyond. This paper discusses the resolution limits that can be achieved with state-of-the-art 0.68 NA exposure systems and optical enhancement techniques such as modified illumination, phase shift masks and optical proximity corrections. The goal is to optimize the imaging process to achieve process windows large enough for use in a manufacturing environment
Keywords
phase shifting masks; proximity effect (lithography); ultraviolet lithography; 0.15 micron; DUV lithography; KrF; KrF excimer laser; chip manufacturing; exposure system; imaging process optimization; off-axis illumination; optical proximity correction; phase shift mask; process window; resolution enhancement technique; semiconductor technology; Apertures; Costs; Focusing; Lenses; Lighting; Lithography; Optical attenuators; Optical imaging; Resists; Semiconductor device manufacture;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems, and Applications, 1999. International Symposium on
Conference_Location
Taipei
ISSN
1524-766X
Print_ISBN
0-7803-5620-9
Type
conf
DOI
10.1109/VTSA.1999.786016
Filename
786016
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