DocumentCode :
3066740
Title :
Physical property based HBT models for SPICE simulation
Author :
Sa-ngiamsak, Chiranut ; Harrold, Stephen J.
Author_Institution :
Dept. of Electr. Eng. & Electron., Univ. of Manchester Inst. of Sci. & Technol., UK
fYear :
2000
fDate :
2000
Firstpage :
265
Lastpage :
270
Abstract :
A one-dimensional analytical model for both graded-base and uniform-base AlGaAs/GaAs Heterojunction Bipolar Transistors (HBTs) with or without band spikes is presented. The model is based on Physical Property Based Equations (PPBEs). The PPBEs are arranged in a form which allows a commercial CAD package (Cadence) to predict the SPICE parameters directly from a transistor profile which specifies the doping, thickness, material properties, energy band structure, and dimensions of the transistor. Implementing the PPBEs within a CAD package provides a powerful tool for a circuit designer. The designer is given the flexibility to investigate the effect of modifications in the transistor profile on the circuit performance, without being restricted to a particular technology. Hence, the design based on this work will be a truly custom integrated circuit design not constrained by the limitations of any technology libraries. The accuracy of the model is tested by comparing predicted SPICE parameters with parameters obtained from fitting to measured transistor characteristics. The predicted I-V characteristics are also compared with the measured characteristics
Keywords :
III-V semiconductors; SPICE; aluminium compounds; gallium arsenide; heterojunction bipolar transistors; semiconductor device models; AlGaAs-GaAs; AlGaAs/GaAs heterojunction bipolar transistor; CAD package; Cadence; I-V characteristics; SPICE simulation; band spike; custom integrated circuit design; graded-base HBT; one-dimensional analytical model; physical property based equation; transistor profile; uniform-base HBT; Analytical models; Design automation; Equations; Gallium arsenide; Heterojunction bipolar transistors; Integrated circuit measurements; Integrated circuit technology; Packaging; SPICE; Semiconductor process modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Performance Electron Devices for Microwave and Optoelectronic Applications, 2000 8th IEEE International Symposium on
Conference_Location :
Glasgow
Print_ISBN :
0-7803-6550-X
Type :
conf
DOI :
10.1109/EDMO.2000.919071
Filename :
919071
Link To Document :
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