• DocumentCode
    3067337
  • Title

    Wafer metrology based on combined optical interferometry

  • Author

    Kim, A. Young Gwang ; Seo, B. Yong Bum ; Joo, C. Ki-Nam

  • Author_Institution
    Dept. of Photonic Eng., Chosun Univ., Gwangju, South Korea
  • fYear
    2013
  • fDate
    June 30 2013-July 4 2013
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    In this presentation, we propose and verify a simple combined interferometer with low coherence scanning interferometry and spectrally-resolved interferometry using NIR SLD to measure both side surface and thickness profiles of a Si wafer at once.
  • Keywords
    elemental semiconductors; light interferometry; silicon; NIR SLD; Si; low coherence scanning interferometry; optical interferometry; side surface profile; silicon wafer metrology; spectrally-resolved interferometry; thickness profile; Cameras; Optical interferometry; Optical surface waves; Semiconductor device measurement; Silicon; Thickness measurement; Wavelength measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2013 Conference on
  • Conference_Location
    Kyoto
  • Type

    conf

  • DOI
    10.1109/CLEOPR.2013.6600582
  • Filename
    6600582
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3067337