DocumentCode :
3067793
Title :
The investigation of recessed channel SOI devices
Author :
Zhang, Xing ; Huang, Ru ; Xi, Xuemei ; Chan, Mansun ; Ko, Ping K. ; Wang, Yangyuan
Author_Institution :
Inst. of Microelectron., Beijing Univ., China
fYear :
1998
fDate :
1998
Firstpage :
720
Lastpage :
723
Abstract :
Recessed channel SOI devices were investigated. In this paper, the structure and processing of such devices is described in detail. The characteristics of a SOI MOSFET using recessed channel technology are much better than normal thick non-depleted and thin-film fully depleted SOI MOSFETs. The 0.15~4.0 μm recessed channel SOI MOSFETs with a silicon channel film of 70 nm and a source/drain silicon film of 160 nm are developed using a submicron process. The transconductance and drain current are increased by 40% more than thin-film fully depleted SOI MOSFETs
Keywords :
CMOS integrated circuits; MOSFET; silicon-on-insulator; SOI MOSFET; drain current; recessed channel SOI devices; submicron process; transconductance; CMOS technology; Etching; MOSFET circuits; Oxidation; Semiconductor films; Silicon; Substrates; Temperature; Thin film circuits; Thin film devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-4306-9
Type :
conf
DOI :
10.1109/ICSICT.1998.786075
Filename :
786075
Link To Document :
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