DocumentCode
3068282
Title
3-dimensional microelectronic integration
Author
Bower, Robert W.
Author_Institution
Dept. of Electr. & Comput. Eng., California Univ., CA, USA
fYear
1998
fDate
1998
Firstpage
741
Lastpage
744
Abstract
A variety of technologies have been applied to the formation of three-dimensional microstructures in the past two decades. In this talk the author describes work in his group to form three-dimensional structures using direct bonding and smart cut techniques
Keywords
integrated circuit technology; micromachining; wafer bonding; 3-dimensional microelectronic integration; direct bonding; smart cut techniques; three-dimensional microstructures; three-dimensional structures; Annealing; Bonding; Materials testing; Microelectronics; Microstructure; Nanostructured materials; Semiconductor materials; Silicon compounds; Substrates; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-4306-9
Type
conf
DOI
10.1109/ICSICT.1998.786099
Filename
786099
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