Title :
Biomaterials for spinal cord regeneration: Outgrowth of presumptive neuronal precursors on electrospun poly(ε)-caprolactone scaffolds microlayered with alternating polyelectrolytes
Author :
Thouas, George A. ; Contreras, Karla G. ; Bernard, Claude C. ; Sun, Gui-Zhi ; Tsang, Kelly ; Zhou, Kun ; Nisbet, David R. ; Forsythe, John S.
Author_Institution :
Division of Biological Engineering, Monash University, Clayton Victoria 3800, Australia
Abstract :
The aim of this study was to assess the feasibility of electrospun poly(ε)-caprolactone (PCL) scaffolds treated with alternating paly-electrolytes as a controllable three-dimensional adhesive substrate for neuronal progenitors. Unmodified PCL surfaces were generally not supportive of mouse embryonic stem cell (mESC) colony adhesion. However, scaffolds surfaced using layer-by-layer (LbL) deposition of heparin/poly-L-lysine encouraged better local adhesion of mESC colonies, and networking of monolayers containing nestin-positive presumptive neurons, similar to laminin coated controls, as observed by immuno-fluorescence microscopy. Confocal microscopy further revealed depth-wise penetration of mESC nestin-positive cell populations, and orientation along grass topographical features in the LbL scaffolds. LbL deposition therefore appears to provide a satisfactory adhesive substrate for contact and mechanical guidance of neuronal outgrowth in three-dimensions.
Keywords :
Adhesives; Embryo; Immune system; Mice; Microscopy; Neurons; Spinal cord; Stem cells; Surface topography; Surface treatment; Animals; Biocompatible Materials; Cell Adhesion; Cell Differentiation; Electrolytes; Embryonic Stem Cells; Heparin; Materials Testing; Mice; Microscopy, Electron, Scanning; Microscopy, Fluorescence; Nerve Regeneration; Neurons; Polyesters; Polylysine; Spinal Cord Injuries; Tissue Engineering; Tissue Scaffolds;
Conference_Titel :
Engineering in Medicine and Biology Society, 2008. EMBS 2008. 30th Annual International Conference of the IEEE
Conference_Location :
Vancouver, BC
Print_ISBN :
978-1-4244-1814-5
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2008.4649534