DocumentCode
3068661
Title
Hydrogen in silicon: defect interactions and applications
Author
Ashok, S.
Author_Institution
Dept. of Eng. Sci., Pennsylvania State Univ., University Park, PA, USA
fYear
1998
fDate
1998
Firstpage
749
Lastpage
752
Abstract
Hydrogen in crystalline silicon has had a checkered impact on VLSI technology-widely studied, yet its alleged presence or use acknowledged in the barest of terms! Among the well-known phenomena are hydrogen diffusion, dopant deactivation, and bulk and interface defect passivation. More recently, hydrogen plasma treatment has been shown to enhance the rate of formation of thermal donors, as well as activate latent defects under subsequent thermal anneal. It has also been found that disordered and defective regions serve very effectively as sinks and sources for atomic hydrogen. An exciting finding of considerable interest to Si VLSI is the reported improvement in Si MOSFET hot carrier reliability when hydrogen is replaced with deuterium in the post-metallization sintering step. Proposed applications of hydrogen in Si also include lowered thermal budget for ion implant anneal, control of transient enhanced diffusion, impurity gettering, and trapping in gate oxide for a nonvolatile memory device. Here we review hydrogen-related phenomena in crystalline silicon, emphasizing defect interactions and potential applications
Keywords
MOSFET; VLSI; annealing; diffusion; elemental semiconductors; getters; hot carriers; hydrogen; impurity-defect interactions; ion implantation; passivation; plasma materials processing; reviews; semiconductor device reliability; silicon; sintering; Si MOSFET hot carrier reliability; Si:H; VLSI technology; bulk defect passivation; crystalline silicon; defect interactions; deuterium; dopant deactivation; gate oxide; hydrogen; hydrogen diffusion; hydrogen plasma treatment; impurity gettering; interface defect passivation; ion implant anneal; latent defects; nonvolatile memory device; post-metallization sintering step; review; silicon; thermal anneal; thermal budget; thermal donors; transient enhanced diffusion; Annealing; Crystallization; Hot carriers; Hydrogen; MOSFET circuits; Passivation; Plasma applications; Plasma sources; Silicon; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-4306-9
Type
conf
DOI
10.1109/ICSICT.1998.786120
Filename
786120
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