• DocumentCode
    3068661
  • Title

    Hydrogen in silicon: defect interactions and applications

  • Author

    Ashok, S.

  • Author_Institution
    Dept. of Eng. Sci., Pennsylvania State Univ., University Park, PA, USA
  • fYear
    1998
  • fDate
    1998
  • Firstpage
    749
  • Lastpage
    752
  • Abstract
    Hydrogen in crystalline silicon has had a checkered impact on VLSI technology-widely studied, yet its alleged presence or use acknowledged in the barest of terms! Among the well-known phenomena are hydrogen diffusion, dopant deactivation, and bulk and interface defect passivation. More recently, hydrogen plasma treatment has been shown to enhance the rate of formation of thermal donors, as well as activate latent defects under subsequent thermal anneal. It has also been found that disordered and defective regions serve very effectively as sinks and sources for atomic hydrogen. An exciting finding of considerable interest to Si VLSI is the reported improvement in Si MOSFET hot carrier reliability when hydrogen is replaced with deuterium in the post-metallization sintering step. Proposed applications of hydrogen in Si also include lowered thermal budget for ion implant anneal, control of transient enhanced diffusion, impurity gettering, and trapping in gate oxide for a nonvolatile memory device. Here we review hydrogen-related phenomena in crystalline silicon, emphasizing defect interactions and potential applications
  • Keywords
    MOSFET; VLSI; annealing; diffusion; elemental semiconductors; getters; hot carriers; hydrogen; impurity-defect interactions; ion implantation; passivation; plasma materials processing; reviews; semiconductor device reliability; silicon; sintering; Si MOSFET hot carrier reliability; Si:H; VLSI technology; bulk defect passivation; crystalline silicon; defect interactions; deuterium; dopant deactivation; gate oxide; hydrogen; hydrogen diffusion; hydrogen plasma treatment; impurity gettering; interface defect passivation; ion implant anneal; latent defects; nonvolatile memory device; post-metallization sintering step; review; silicon; thermal anneal; thermal budget; thermal donors; transient enhanced diffusion; Annealing; Crystallization; Hot carriers; Hydrogen; MOSFET circuits; Passivation; Plasma applications; Plasma sources; Silicon; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    0-7803-4306-9
  • Type

    conf

  • DOI
    10.1109/ICSICT.1998.786120
  • Filename
    786120