DocumentCode :
3071520
Title :
Localized Pattern-Dependent Damage to Metal During Etch
Author :
Gabriel, Calvin T.
Author_Institution :
VLSI Technology, Inc.
fYear :
1996
fDate :
13-14 May 1996
Firstpage :
117
Lastpage :
119
Keywords :
Aluminum alloys; Copper; Ocean temperature; Plasma applications; Plasma temperature; Resists; Scanning electron microscopy; Sputter etching; Sputtering; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Process-Induced Damage, 1996 1st International Symposium on
Print_ISBN :
0-9651577-0-9
Type :
conf
DOI :
10.1109/PPID.1996.715216
Filename :
715216
Link To Document :
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