DocumentCode

3072740

Title

Effect of Process & Etch Variables on Contact Resistance

Author

MacPhie, A. ; Anderson, P. ; Boyd, G.

Author_Institution

Motorola

fYear

1996

fDate

13-14 May 1996

Firstpage

141

Lastpage

144

Keywords

Argon; Contact resistance; Dielectric films; Dielectric substrates; Dry etching; Plasma applications; Plasma chemistry; Resists; Silicon; Strips;

fLanguage

English

Publisher

ieee

Conference_Titel

Plasma Process-Induced Damage, 1996 1st International Symposium on

Print_ISBN

0-9651577-0-9

Type

conf

DOI

10.1109/PPID.1996.715223

Filename

715223