Experimental study on the performance of compact heat sink for LSI packages

Author

Hatakeyama, T. ; Ishizuka, M. ; Kibushi, Risako

Author_Institution

Mech. Syst. Eng., Toyama Prefectural Univ., Toyama, Japan

fYear

2012

fDate

24-26 Oct. 2012

Firstpage

193

Lastpage

196

Abstract

This paper describes experimental study about cooling performance of natural and forced air convection in compact heat sinks for LSI packages. Temperature rise of several heat sinks having different base areas, fin intervals and fin heights was measured. In natural convection case, the effect of supplied power on the temperature rise of the fin was examined. In forced convection case, correlations between air flow velocity and temperature rise were examined. Further, based on those results, non-dimensional expressions to evaluate cooling performance of compact heat sinks were proposed.

Keywords

cooling; forced convection; heat measurement; heat sinks; integrated circuit packaging; large scale integration; natural convection; temperature; LSI package; air flow velocity; compact heat sink; cooling performance; fin height measurement; fin interval; forced air convection; natural air convection; temperature rise; Correlation; Heat sinks; Heat transfer; Heating; Large scale integration; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International

Conference_Location

Taipei

ISSN

2150-5934

Print_ISBN

978-1-4673-1635-4

Electronic_ISBN

2150-5934

Type

conf

DOI

10.1109/IMPACT.2012.6420225

Filename

6420225