• DocumentCode
    3073024
  • Title

    Room temperature debonding — An enabling technology for TSV and 3D integration

  • Author

    Matthias, T. ; Pauzenberger, G. ; Burggraf, Jurgen ; Burgstaller, Daniel ; Lindner, Philipp

  • Author_Institution
    EV Group, St. Florian am Inn, Austria
  • fYear
    2012
  • fDate
    24-26 Oct. 2012
  • Firstpage
    46
  • Lastpage
    48
  • Abstract
    ZoneBONDTM is a revolutionary breakthrough in thin wafer processing. It enables room temperature debonding method, which is independent from the properties of the temporary adhesive. Thereby it enables a standardization of the debonding process and debonding equipment as it is material independent. The ZoneBONDTM Open Platform enables a versatile supply chain with multiple adhesive suppliers.
  • Keywords
    integrated circuit interconnections; three-dimensional integrated circuits; wafer bonding; 3D integration; TSV; ZoneBOND; room temperature debonding; supply chain; thin wafer processing; Adhesives; Performance evaluation; Stacking; Temperature; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4673-1635-4
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2012.6420231
  • Filename
    6420231
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3073024