DocumentCode
3073074
Title
Direct EP and direct EPAG — Novel surface finishes for gold-, copper wire bonding and soldering applications
Author
Ozkok, Mustafa
Author_Institution
Atotech Germany, Berlin, Germany
fYear
2012
fDate
24-26 Oct. 2012
Firstpage
178
Lastpage
182
Abstract
The direct deposition of palladium on copper is not a new surface finish process. Palladium was first introduced to the market as a surface finish on copper by Atotech more than 10 years ago. At that time, it was primarily used as a surface finish for soldering. In addition, it was employed as a contact surface in applications like touch key pads.
Keywords
copper; gold; lead bonding; palladium; soldering; surface finishing; Atotech; Au; Cu; Pd; contact surface; copper; direct EPAG; gold; palladium; soldering; surface finish; wire bonding; Bonding; Copper; Gold; Nickel; Surface finishing; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4673-1635-4
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2012.6420234
Filename
6420234
Link To Document