Title :
Infrared thermography of BGA´s heated by Focused Infrared Light Soldering System
Author :
Felix, M. ; Anguiano, C. ; Medel, A. ; Bravo, Mikel ; Salazar, Daniel ; Marquez, Horacio
Author_Institution :
Eng. Fac., Univ. Autonoma de Baja California, Mexico City, Mexico
Abstract :
In this work, we present a thermal distribution measurement and analysis on the surface area of a Ball Grid Array (BGA), soldered by means of a Focused Infrared Light Soldering System (FILSS), which meets the BGA surface mount device (SMD) reflow solder heating profile.
Keywords :
ball grid arrays; infrared imaging; reflow soldering; surface mount technology; BGA; FILSS; SMD; ball grid array; focused infrared light soldering system; infrared thermography; reflow solder heating profile; surface area; surface mount device; thermal distribution measurement; Cameras; Heat transfer; Infrared heating; Materials; Soldering; Temperature distribution;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1635-4
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2012.6420236
