Title :
Modeling of pore formation in solid
Author :
Wei, P.S. ; Hsiao, S.Y. ; Wu, Ming C.
Author_Institution :
Dept. of Mech. & Electro-Mech. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Abstract :
Quality and microstructure of materials are strongly affected by the shapes of pores in solids, which are encountered in almost all the packaging, micro-electro-mechanical systems (MEMS), and manufacturing fields. This study theoretically analyzes the mechanisms of an entrapped micro-bubble as a pore in the solid. A phase diagram, as introduced previously to be satisfied by interfacial normal stress balance, can be used to control and delineate the growing path and final shape of a pore. The predicted pore shape agrees with experimental results.
Keywords :
bubbles; micromechanical devices; phase diagrams; semiconductor device packaging; solidification; MEMS; entrapped microbubble; interfacial normal stress balance; manufacturing field; material microstructure; material quality; microelectro-mechanical system; packaging; phase diagram; pore formation modeling; solid pore shape; Equations; IEEE catalog; Liquids; Mathematical model; Shape; Solid modeling; Solids;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1635-4
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2012.6420238