• DocumentCode
    3073157
  • Title

    Modeling of pore formation in solid

  • Author

    Wei, P.S. ; Hsiao, S.Y. ; Wu, Ming C.

  • Author_Institution
    Dept. of Mech. & Electro-Mech. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
  • fYear
    2012
  • fDate
    24-26 Oct. 2012
  • Firstpage
    60
  • Lastpage
    63
  • Abstract
    Quality and microstructure of materials are strongly affected by the shapes of pores in solids, which are encountered in almost all the packaging, micro-electro-mechanical systems (MEMS), and manufacturing fields. This study theoretically analyzes the mechanisms of an entrapped micro-bubble as a pore in the solid. A phase diagram, as introduced previously to be satisfied by interfacial normal stress balance, can be used to control and delineate the growing path and final shape of a pore. The predicted pore shape agrees with experimental results.
  • Keywords
    bubbles; micromechanical devices; phase diagrams; semiconductor device packaging; solidification; MEMS; entrapped microbubble; interfacial normal stress balance; manufacturing field; material microstructure; material quality; microelectro-mechanical system; packaging; phase diagram; pore formation modeling; solid pore shape; Equations; IEEE catalog; Liquids; Mathematical model; Shape; Solid modeling; Solids;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4673-1635-4
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2012.6420238
  • Filename
    6420238