DocumentCode :
3073256
Title :
A temperature accelerated model for high state retention loss of nitride storage flash memory
Author :
Lee, M.Y. ; Zous, N.K. ; Huang, Trista ; Tsai, W.J. ; Kuo, Alben ; Wang, Tahui ; Yin, Shaw ; Lu, Chih-Yuan
Author_Institution :
Macronix Int. Co. Ltd., Hsin-Chu, Taiwan
fYear :
2004
fDate :
18-21 Oct. 2004
Firstpage :
11
Lastpage :
14
Abstract :
A temperature accelerated model, which is based on the tunneling out of the thermally emitted electrons in the nitride layer via traps at the bottom oxide, is proposed to explain the retention loss behavior of high VT states in MXVAND products with respect to bake temperature, bake time, and cycling numbers. The model parameters can be easily extracted and the fitting results show an acceptable accuracy. According to this model, the retention loss should follow a straight line on a semi-log scale and the slope is proportional to the temperature. Besides, the cycling number dependence is successfully reproduced by considering the erase degradation and the growth rate of oxide traps.
Keywords :
electron traps; flash memories; integrated circuit modelling; integrated circuit reliability; life testing; tunnelling; MXVAND; bake temperature; bake time; bottom oxide traps; cycling number dependence; erase degradation; high state retention loss; nitride layer; nitride storage flash memory; oxide trap growth rate; temperature accelerated model; thermally emitted electron tunneling; Acceleration; Charge carrier processes; Degradation; Electron emission; Electron traps; Flash memory; Temperature; Testing; Tunneling; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2004 IEEE International
Print_ISBN :
0-7803-8517-9
Type :
conf
DOI :
10.1109/IRWS.2004.1422728
Filename :
1422728
Link To Document :
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