• DocumentCode
    3073256
  • Title

    A temperature accelerated model for high state retention loss of nitride storage flash memory

  • Author

    Lee, M.Y. ; Zous, N.K. ; Huang, Trista ; Tsai, W.J. ; Kuo, Alben ; Wang, Tahui ; Yin, Shaw ; Lu, Chih-Yuan

  • Author_Institution
    Macronix Int. Co. Ltd., Hsin-Chu, Taiwan
  • fYear
    2004
  • fDate
    18-21 Oct. 2004
  • Firstpage
    11
  • Lastpage
    14
  • Abstract
    A temperature accelerated model, which is based on the tunneling out of the thermally emitted electrons in the nitride layer via traps at the bottom oxide, is proposed to explain the retention loss behavior of high VT states in MXVAND products with respect to bake temperature, bake time, and cycling numbers. The model parameters can be easily extracted and the fitting results show an acceptable accuracy. According to this model, the retention loss should follow a straight line on a semi-log scale and the slope is proportional to the temperature. Besides, the cycling number dependence is successfully reproduced by considering the erase degradation and the growth rate of oxide traps.
  • Keywords
    electron traps; flash memories; integrated circuit modelling; integrated circuit reliability; life testing; tunnelling; MXVAND; bake temperature; bake time; bottom oxide traps; cycling number dependence; erase degradation; high state retention loss; nitride layer; nitride storage flash memory; oxide trap growth rate; temperature accelerated model; thermally emitted electron tunneling; Acceleration; Charge carrier processes; Degradation; Electron emission; Electron traps; Flash memory; Temperature; Testing; Tunneling; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2004 IEEE International
  • Print_ISBN
    0-7803-8517-9
  • Type

    conf

  • DOI
    10.1109/IRWS.2004.1422728
  • Filename
    1422728