DocumentCode
3073334
Title
HSHPTM program application in optimum of heat pipes thermal module
Author
Jung-Chang Wang ; Wei-Jui Chen ; Fu-Hsiung Yu
Author_Institution
Dept. of Marine Eng., Nat. Taiwan Ocean Univ. (NTOU), Keelung, Taiwan
fYear
2012
fDate
24-26 Oct. 2012
Firstpage
291
Lastpage
294
Abstract
Embedded U-type or L-type heat pipes into fins and based plate form a heat sink-heat pipes thermal module (HSHPTM), which transfers the total heat capacity from the heat source to the based plate and fins successfully, and then dissipates heat flow into the surrounding air. The main purpose of this study is to establish the theoretical model and thermal performance of the HSHPTM under different wind speeds, and calculate the heat flow of individual embedded heat pipes employed Newton´s method and Gauss-Seidel iteration method. This paper employs a window program named HSHPTM V1.0 coded by Visual Basic commercial software to develop for optimum designing the heat sink-heat pipes thermal module. The computing core of HSHPTM program applies the theoretical thermal resistance analytical approach with iterative convergence stated in this article to obtain the numerical solutions. The results show that this calculating error comparison with experimental results is within ± 5%. This HSHPTM has the benefit of rapidly calculating the thermal performance of a heat sink-heat pipes thermal module.
Keywords
Newton method; heat pipes; heat sinks; heat transfer; specific heat; thermal management (packaging); Gauss-Seidel iteration method; HSHPTM V1.0; HSHPTM program application; L-type heat pipes; Newton´s method; based plate; embedded U-type heat pipes; fins; heat capacity; heat flow; heat sink-heat pipes thermal module; heat source; iterative convergence; numerical solutions; theoretical thermal resistance analytical approach; thermal performance; visual basic commercial software; wind speeds; window program; Electronic packaging thermal management; Heat sinks; Heat transfer; Resistance heating; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4673-1635-4
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2012.6420248
Filename
6420248
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