• DocumentCode
    3073334
  • Title

    HSHPTM program application in optimum of heat pipes thermal module

  • Author

    Jung-Chang Wang ; Wei-Jui Chen ; Fu-Hsiung Yu

  • Author_Institution
    Dept. of Marine Eng., Nat. Taiwan Ocean Univ. (NTOU), Keelung, Taiwan
  • fYear
    2012
  • fDate
    24-26 Oct. 2012
  • Firstpage
    291
  • Lastpage
    294
  • Abstract
    Embedded U-type or L-type heat pipes into fins and based plate form a heat sink-heat pipes thermal module (HSHPTM), which transfers the total heat capacity from the heat source to the based plate and fins successfully, and then dissipates heat flow into the surrounding air. The main purpose of this study is to establish the theoretical model and thermal performance of the HSHPTM under different wind speeds, and calculate the heat flow of individual embedded heat pipes employed Newton´s method and Gauss-Seidel iteration method. This paper employs a window program named HSHPTM V1.0 coded by Visual Basic commercial software to develop for optimum designing the heat sink-heat pipes thermal module. The computing core of HSHPTM program applies the theoretical thermal resistance analytical approach with iterative convergence stated in this article to obtain the numerical solutions. The results show that this calculating error comparison with experimental results is within ± 5%. This HSHPTM has the benefit of rapidly calculating the thermal performance of a heat sink-heat pipes thermal module.
  • Keywords
    Newton method; heat pipes; heat sinks; heat transfer; specific heat; thermal management (packaging); Gauss-Seidel iteration method; HSHPTM V1.0; HSHPTM program application; L-type heat pipes; Newton´s method; based plate; embedded U-type heat pipes; fins; heat capacity; heat flow; heat sink-heat pipes thermal module; heat source; iterative convergence; numerical solutions; theoretical thermal resistance analytical approach; thermal performance; visual basic commercial software; wind speeds; window program; Electronic packaging thermal management; Heat sinks; Heat transfer; Resistance heating; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4673-1635-4
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2012.6420248
  • Filename
    6420248