A novel sample preparation technique for 3D_IC micro-bumps for wider region observation

With the demands of higher multifunctional performance, 3D chips in stacking technology are widely developed recently. But the methods of 3D micro-bumps observation are normally confined to narrow widths. The polished width of either way of FIB or CP method is just able to reach the range of several to hundreds of micrometers. In this study, expanding to 3000 um of polished width is achievable by special sample preparation technique in iST. And the milling result of this system reveals the same quality of cross-section image compared to both FIB and CP methods.