DocumentCode
3073838
Title
Computational study on vaporizing liquid micro-thruster
Author
Chia-Chin Chen ; Heng-Chuan Kan ; Ming-Hsiao Lee ; Chien-Wei Liu
Author_Institution
Comput. Eng. Div., Nat. Center for High-Performance Comput., Tainan, Taiwan
fYear
2012
fDate
24-26 Oct. 2012
Firstpage
68
Lastpage
71
Abstract
Simulation results showed that the models which consist of the pillar array structure induced more droplet collisions than those models constructed by the circle block, semi-circle block, ellipsoid block, and bevel fins, and avoided the deflection of the droplets which was revealed in the serpentine model. In addition, within the VLM chip, the wall temperature was much higher than the fluid temperature and certainly higher than those of the droplets in the flow due to the saturation temperature of fluid. Therefore, the more collisions occurred, the higher the droplet temperature was, due to the high heat flux caused by conduction between the droplets and the wall. Also, the longer flying durations of the droplets caused by the collisions increased the droplet temperature. The high droplet temperature implied the increase of the evaporation rate in the real VLM chip. Furthermore, the design with the pillar array structure provided a well axial thrust due to the symmetric trajectories of the droplets. From the viewpoint of the propellant efficiency and the properties of the ejected plume, the model with the pillar array structure is the best design pattern in the present study. In addition, the optimum pillar spacing should be 250 μm (center-to-center distances between two lines of pillar) in this work.
Keywords
aerospace propulsion; design; evaporation; propellants; axial thrust; design pattern; droplet collision; evaporation rate; heat flux; pillar array structure; propellant efficiency; serpentine model; vaporizing liquid microthruster; wall temperature; Arrays; Computational modeling; Heating; Liquids; Propulsion; Simulation; Trajectory;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4673-1635-4
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2012.6420277
Filename
6420277
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