• DocumentCode
    3074005
  • Title

    The preferential growth of η-Cu6Sn5 on (111) uni-directional Cu pads

  • Author

    Han-Wen Lin ; Jia-ling Lu ; Chen-min Liu ; Chih Chen ; King-Ning Tu ; Delphic Chen ; Jui-Chao Kuo

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2012
  • fDate
    24-26 Oct. 2012
  • Firstpage
    90
  • Lastpage
    93
  • Abstract
    In this paper, we produce a layer of (111) uni-directional Cu by electroplating. The SnAg 2.3 was used as solder materials. The orientations relationship between uni-directional Cu and Cu6Sn5 were examined. Also, the effect of quality of uni-directional Cu on the orientation of Cu6Sn5 was discussed.
  • Keywords
    copper alloys; electroplating; silver alloys; soldering; tin alloys; Cu6Sn5; SnAg; electroplating; orientations relationship; preferential growth; solder materials; Copper; Image color analysis; Intermetallic; Joints; Soldering; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4673-1635-4
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2012.6420285
  • Filename
    6420285
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3074005