DocumentCode :
3074005
Title :
The preferential growth of η-Cu6Sn5 on (111) uni-directional Cu pads
Author :
Han-Wen Lin ; Jia-ling Lu ; Chen-min Liu ; Chih Chen ; King-Ning Tu ; Delphic Chen ; Jui-Chao Kuo
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
2012
fDate :
24-26 Oct. 2012
Firstpage :
90
Lastpage :
93
Abstract :
In this paper, we produce a layer of (111) uni-directional Cu by electroplating. The SnAg 2.3 was used as solder materials. The orientations relationship between uni-directional Cu and Cu6Sn5 were examined. Also, the effect of quality of uni-directional Cu on the orientation of Cu6Sn5 was discussed.
Keywords :
copper alloys; electroplating; silver alloys; soldering; tin alloys; Cu6Sn5; SnAg; electroplating; orientations relationship; preferential growth; solder materials; Copper; Image color analysis; Intermetallic; Joints; Soldering; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4673-1635-4
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2012.6420285
Filename :
6420285
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3074005
بازگشت