DocumentCode
3074091
Title
Next generation electroplating technology for high planarity, minimum surface deposition microvia filling
Author
Ming-Yao Yen ; Ming-Hung Chiang ; Hsu-Hsin Tai ; Hsien-Chang Chen ; Kwok-Wai Yee ; Li, Cong ; Lefebvre, M. ; Bayes, M.
Author_Institution
Dow Electron. Mater., Dow Chem. Co., Taoyuan Hsien, Taiwan
fYear
2012
fDate
24-26 Oct. 2012
Firstpage
259
Lastpage
262
Abstract
The combination of specialized equipment and new copper via fill chemistry offers end users a cost effective, highly capable and production proven process for IC package substrate microvias filling. A new, insoluble anode, DC microvia fill system is now available for high volume manufacturing (HVM), offering additional operating flexibility and end user preference.
Keywords
copper; electroplating; integrated circuit packaging; vias; DC microvia filling; HVM; IC package substrate; electrolytic copper microvia filling; high volume manufacturing; insoluble anode; next generation electroplating technology surface deposition; Anodes; Copper; Current density; Filling; Production; Substrates; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4673-1635-4
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2012.6420290
Filename
6420290
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