Title :
IRW 2004 Special Interest Group (SIG) - Al and Cu test structure designs for stress voiding
Keywords :
Aluminum; Ambient intelligence; Artificial intelligence; Copper; Guidelines; Metallization; Microelectronics; NIST; Stress; Testing;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2004 IEEE International
Print_ISBN :
0-7803-8517-9
DOI :
10.1109/IRWS.2004.1422776
