DocumentCode
3074169
Title
Physical and numerical investigation of single-layered tungsten gratings for thermophotovoltaic emitters
Author
Nghia Nguyen-Huu ; Yu-Bin Chen ; Yu-Lung Lo
Author_Institution
Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
fYear
2012
fDate
24-26 Oct. 2012
Firstpage
400
Lastpage
403
Abstract
A polarization-insensitive thermophotovoltaic emitter which is easily manufactured using microfabrication techniques is optimized based on physical and numerical studies. First, ranges of geometrical dimensions of the emitter based a single-layered tungsten grating are confined with the excitation of surface plasmon polaritons, cavity resonance, and Wood´s anomaly at defined wavelengths. Then, a combined numerical scheme including the rigorous coupled-wave analysis and a genetic algorithm is implemented to find the grating´s geometry with an objective of maximizing emittance. The results show that the optimized emitter yields the peak emittance of 0.997 and 0.935 at the transverse electric and transverse magnetic polarizations, respectively. The physical mechanism of the enhanced emittance is also confirmed by patterns of electromagnetic fields and Poynting vectors using the finite difference time-domain method. Overall, the results presented in this study show that the single-layered grating provides a very simple and ideal solution for thermophotovoltaic applications.
Keywords
finite difference time-domain analysis; genetic algorithms; microfabrication; polarisation; polaritons; surface plasmons; tungsten; Poynting vectors; Wood anomaly; cavity resonance; coupled-wave analysis; electromagnetic fields; finite difference time-domain method; genetic algorithm; microfabrication; polarization-insensitive thermophotovoltaic emitter; single-layered tungsten gratings; surface plasmon polaritons; transverse electric polarization; transverse magnetic polarization; Genetic algorithms; Gratings; Optical filters; Optical sensors; Optimized production technology; Tungsten; Vectors;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4673-1635-4
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2012.6420295
Filename
6420295
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