Design and implementation of mobile communications SiP modules with embedded components in multilayer organic hybrid substrate

In recent years, fashion mobile phones and other portable electronic products constantly challenge extreme slim design and then they stimulate a rapid development for SiP (system in package) technology. Traditional SMT (Surface Mount Technology) approaches to design and manufacture modules that are still too large. The SOC may reach the demand of miniaturization, but it is still technically difficult to overcome. SiP technology becomes a major consideration and selection of the miniaturized wireless broadband communication technologies. It has been widely applied on Bluetooth, WiFi, and so on. This paper uses SiP technology to realize 3.5G mobile communications modules in multilayer organic hybrid substrate.