Title :
Thermal performance of Various heat sinks
Abstract :
Cooling of electronics has received considerable attention recently. Simplicity and easy maintenance make direct air cooling a most attractive approach in cooling of electronics. Various heat sinks are often mounted to the microelectronic components in order to enhance thermal performance so that the components can be kept below the respective temperature limits.
Keywords :
cooling; electronics packaging; heat sinks; electronic cooling; heat sink; microelectronic components; thermal performance; Heat sinks; Heat transfer; Resistance heating; Space heating; Thermal resistance;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1635-4
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2012.6420310
