DocumentCode
3074428
Title
Thermal performance of Various heat sinks
Author
Lian-Tuu Yeh
fYear
2012
fDate
24-26 Oct. 2012
Firstpage
205
Lastpage
208
Abstract
Cooling of electronics has received considerable attention recently. Simplicity and easy maintenance make direct air cooling a most attractive approach in cooling of electronics. Various heat sinks are often mounted to the microelectronic components in order to enhance thermal performance so that the components can be kept below the respective temperature limits.
Keywords
cooling; electronics packaging; heat sinks; electronic cooling; heat sink; microelectronic components; thermal performance; Heat sinks; Heat transfer; Resistance heating; Space heating; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4673-1635-4
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2012.6420310
Filename
6420310
Link To Document