• DocumentCode
    3074504
  • Title

    Heat conduction in low-dimensional structures

  • Author

    Chen, G.

  • Author_Institution
    Dept. of Mech. Aerosp. Eng., California Univ., Los Angeles, CA, USA
  • fYear
    1998
  • fDate
    1998
  • Firstpage
    860
  • Abstract
    Summary form only given, as follows: Understanding phonon heat conduction mechanisms in low-dimensional structures is of great interest for thermoelectric and microelectronic applications. In this paper, we discuss modeling and experimental results for heat conduction in 2-D and 1-D systems. For 2-D systems, models based on solving the phonon Boltzmann transport equation are developed for heat conduction in both the in-plane and the cross-plane directions of GaAs/AlAs and Si/Six Ge1-x superlattices. Different interface scattering mechanisms are considered, including elastic vs. inelastic, and diffuse vs. specular. A comparison of the modeling and experimental results shows that the effective thermal conductivity of superlattices is controlled by interface scattering of phonons. Inelastic phonon scattering occurs at the interfaces. Modeling results based on partially diffuse and partially specular interfaces are in reasonable agreement with experimental data
  • Keywords
    Boltzmann equation; electron-phonon interactions; superlattices; thermal conductivity; thermoelectricity; 1D systems; 2D systems; heat conduction; inelastic phonon scattering; interface scattering; low-dimensional structures; partially diffuse interfaces; partially specular interfaces; phonon Boltzmann transport equation; phonon heat conduction; superlattices; Conducting materials; Phonons; Refrigeration; Scattering; Semiconductor materials; Tellurium; Temperature sensors; Thermal conductivity; Thermoelectricity; USA Councils;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    0-7803-4306-9
  • Type

    conf

  • DOI
    10.1109/ICSICT.1998.786465
  • Filename
    786465