DocumentCode
3074504
Title
Heat conduction in low-dimensional structures
Author
Chen, G.
Author_Institution
Dept. of Mech. Aerosp. Eng., California Univ., Los Angeles, CA, USA
fYear
1998
fDate
1998
Firstpage
860
Abstract
Summary form only given, as follows: Understanding phonon heat conduction mechanisms in low-dimensional structures is of great interest for thermoelectric and microelectronic applications. In this paper, we discuss modeling and experimental results for heat conduction in 2-D and 1-D systems. For 2-D systems, models based on solving the phonon Boltzmann transport equation are developed for heat conduction in both the in-plane and the cross-plane directions of GaAs/AlAs and Si/Six Ge1-x superlattices. Different interface scattering mechanisms are considered, including elastic vs. inelastic, and diffuse vs. specular. A comparison of the modeling and experimental results shows that the effective thermal conductivity of superlattices is controlled by interface scattering of phonons. Inelastic phonon scattering occurs at the interfaces. Modeling results based on partially diffuse and partially specular interfaces are in reasonable agreement with experimental data
Keywords
Boltzmann equation; electron-phonon interactions; superlattices; thermal conductivity; thermoelectricity; 1D systems; 2D systems; heat conduction; inelastic phonon scattering; interface scattering; low-dimensional structures; partially diffuse interfaces; partially specular interfaces; phonon Boltzmann transport equation; phonon heat conduction; superlattices; Conducting materials; Phonons; Refrigeration; Scattering; Semiconductor materials; Tellurium; Temperature sensors; Thermal conductivity; Thermoelectricity; USA Councils;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-4306-9
Type
conf
DOI
10.1109/ICSICT.1998.786465
Filename
786465
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