Title :
Laterally capacity sensed accelerometer fabricated with the anodic bonding and the high aspect ratio etching
Author :
Xiao, Zhixiong ; Wu, Guoying ; Zhang, Guobing ; Hao, Yilong ; Li, Zhihong ; Zhang, Dacheng ; Chen, Wenru ; Wang, Yangyuan ; Changde Zhan ; Chen, Min
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing, China
Abstract :
This paper presents a new kind of laterally capacity sensed accelerometer fabricated with silicon/glass anodic bonding and the ICP (Induced Coupled Plasma) high aspect ratio etching. The detailed testing from -1g to +1g (1g represents one acceleration of gravity) shows quite good performance
Keywords :
accelerometers; anodisation; elemental semiconductors; microsensors; plasma materials processing; silicon; sputter etching; wafer bonding; ICP; Si; acceleration; anodic bonding; high aspect ratio etching; induced coupled plasma high aspect ratio etching; laterally capacity sensed accelerometer; silicon/glass anodic bonding; testing; Accelerometers; Bonding; Etching; Glass; Gravity; Life estimation; Plasma accelerators; Plasma applications; Silicon; Testing;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-4306-9
DOI :
10.1109/ICSICT.1998.786521
