Title :
Technology of double side exposure and bonding for fabrication of accelerometer
Author :
Zhang, Taiping ; Li, Ting ; Deng, Ke
Author_Institution :
Peking Univ., Beijing, China
Abstract :
The authors use double sided exposure and bonding and deep etching to fabricate accelerometers and gyroscopes. The technology is based on MEMS processing. The sensor testing is presented
Keywords :
accelerometers; etching; gyroscopes; microsensors; semiconductor device testing; wafer bonding; MEMS processing; accelerometer; bonding; deep etching; double side exposure; fabrication; gyroscopes; sensor testing; Accelerometers; Electrodes; Etching; Fabrication; Fixtures; Glass; Micromechanical devices; Shape; Silicon; Wafer bonding;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-4306-9
DOI :
10.1109/ICSICT.1998.786524
