DocumentCode
3075417
Title
Technology of double side exposure and bonding for fabrication of accelerometer
Author
Zhang, Taiping ; Li, Ting ; Deng, Ke
Author_Institution
Peking Univ., Beijing, China
fYear
1998
fDate
1998
Firstpage
925
Lastpage
927
Abstract
The authors use double sided exposure and bonding and deep etching to fabricate accelerometers and gyroscopes. The technology is based on MEMS processing. The sensor testing is presented
Keywords
accelerometers; etching; gyroscopes; microsensors; semiconductor device testing; wafer bonding; MEMS processing; accelerometer; bonding; deep etching; double side exposure; fabrication; gyroscopes; sensor testing; Accelerometers; Electrodes; Etching; Fabrication; Fixtures; Glass; Micromechanical devices; Shape; Silicon; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-4306-9
Type
conf
DOI
10.1109/ICSICT.1998.786524
Filename
786524
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