DocumentCode
3076646
Title
Transformation of Ti and TiN Cap Layer by Via-Hole Etching
Author
Sudo, Shoji ; Ichihashi, Yoshinari ; Ikeda, Norihiro ; Taketa, Kaoru ; Marneno, K.
Author_Institution
SANYO Electric Co., Ltd.
fYear
1996
fDate
14-14 May 1996
Firstpage
230
Lastpage
233
Keywords
Argon; Artificial intelligence; Contact resistance; Dry etching; Electrical resistance measurement; Plasma applications; Plasma measurements; Plasma properties; Resists; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Process-Induced Damage, 1996 1st International Symposium on
Conference_Location
Santa Clara, CA, USA
Print_ISBN
0-9651577-0-9
Type
conf
DOI
10.1109/PPID.1996.715245
Filename
715245
Link To Document