• DocumentCode
    3077045
  • Title

    The influence of strain on the dielectric behavior of (Bax Sr1-x)Ti1+yO3+z thin films grown by LS-MOCVD on Pt/SiO2/Si

  • Author

    Streiffer, S.K. ; Basceri, C. ; Parker, C.B. ; Lash, S.E. ; Christman, J. ; Maiwa, H. ; Kingon, Angus I.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., North Carolina State Univ., Raleigh, NC, USA
  • fYear
    1998
  • fDate
    1998
  • Firstpage
    31
  • Lastpage
    34
  • Abstract
    The strain state and its coupling to dielectric behavior have been investigated for {100} BST thin films deposited on Pt/SiO2/Si at 640°C. It is estimated from X-ray diffraction that the in-plane biaxial strain is approximately 0.7%. We postulate that this is of sufficient magnitude to confine any spontaneous polarization to the plane of the film. The thickness-corrected dielectric behavior perpendicular to the substrate for these samples shows evidence of coupling to such an in-plane phase transition at approximately 390 K, as manifested by deviation from Curie-Weiss-like behavior at this temperature
  • Keywords
    MOCVD coatings; X-ray diffraction; barium compounds; dielectric polarisation; ferroelectric materials; ferroelectric thin films; internal stresses; permittivity; strontium compounds; (BaxSr1-x)Ti1+yO3+z thin films; (BaSr)TiO3; 640 degC; Curie-Weiss-like behavior; LS-MOCVD; Pt; Pt/SiO2/Si; Si; SiO2; X-ray diffraction; dielectric behavior; in-plane biaxial strain; in-plane phase transition; spontaneous polarization; strain effect; strain state; thickness-corrected dielectric behavior; Binary search trees; Capacitive sensors; Dielectric films; Dielectric substrates; Dielectric thin films; Polarization; Semiconductor thin films; Sputtering; Temperature; X-ray diffraction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applications of Ferroelectrics, 1998. ISAF 98. Proceedings of the Eleventh IEEE International Symposium on
  • Conference_Location
    Montreux
  • ISSN
    1099-4734
  • Print_ISBN
    0-7803-4959-8
  • Type

    conf

  • DOI
    10.1109/ISAF.1998.786629
  • Filename
    786629