• DocumentCode
    3077439
  • Title

    Breakdown mechanism in insulating zinc oxide film

  • Author

    Gupta, Vinay ; Mansingh, A.

  • Author_Institution
    Dept. of Phys., Delhi Univ., India
  • fYear
    1998
  • fDate
    1998
  • Firstpage
    113
  • Lastpage
    116
  • Abstract
    A highly c-axis oriented and insulating zinc oxide (ZnO) thin film has been deposited by rf sputtering at room temperature. We have attempted to establish the mechanism of breakdown in insulating ZnO films in a metal-insulator-metal configuration using capacitance-voltage (C-V) and conductance-voltage (G-V) characteristics. The C-V characteristics exhibit hysteresis during the retrace. The G-V characteristic was linear for both forward and reverse bias for small bias voltages. However, for a large bias strong directional behavior depending on the polarity of the applied bias was observed. The magnitude of the maximum value of conductance and the breakdown field were found to depend on the sweep rate indicating a thermal origin for the breakdown. The non-linearity is found to depend on the substrate metallization. The Influence of bottom electrodes on the dielectric properties is also discussed
  • Keywords
    II-VI semiconductors; MIM structures; dielectric hysteresis; electric breakdown; insulating thin films; sputter deposition; zinc compounds; 293 K; C-V characteristics; RF sputtering; ZnO; applied bias polarity; breakdown mechanism; c-axis oriented film; hysteresis; insulating film; metal-insulator-metal configuration; substrate metallization; sweep rate; Capacitance-voltage characteristics; Conductive films; Dielectric substrates; Electric breakdown; Hysteresis; Insulation; Metal-insulator structures; Sputtering; Temperature; Zinc oxide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applications of Ferroelectrics, 1998. ISAF 98. Proceedings of the Eleventh IEEE International Symposium on
  • Conference_Location
    Montreux
  • ISSN
    1099-4734
  • Print_ISBN
    0-7803-4959-8
  • Type

    conf

  • DOI
    10.1109/ISAF.1998.786649
  • Filename
    786649