Flip chip bonding using isotropically conductive adhesives

Author

Rösner, Bela ; Liu, Johan ; Lai, Zonghe

Author_Institution

Thomson Multimedia, Villingen, Switzerland

fYear

1996

fDate

28-31 May 1996

Firstpage

578

Lastpage

581

Abstract

In this paper results of investigations concerning the reliability of adhesive bumps are presented. These bumps interconnect test flip chips with different sizes to both Al₂O₃ and FR4 substrates. The samples have been exposed to thermal cycling. The transition resistance of the bumps [TRR], and the resistance of daisy chains as criteria of the interconnection´s quality, have been measured at different time instances of the environmental stress. Ag migration investigations were also carried out. This study shows that there is no reliable adhesive bump interconnection without the use of underfill material

Keywords

adhesion; conducting polymers; filled polymers; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; lead bonding; Ag migration; Al₂O₃; Al₂O₃ substrates; FR4 substrates; adhesive bump reliability; daisy chains; environmental stress; flip chip bonding; interconnection quality; isotropically conductive adhesives; thermal cycling; transition resistance; underfill material; Bonding; Conductive adhesives; Electrical resistance measurement; Flip chip; Materials reliability; Semiconductor device measurement; Stress measurement; Testing; Thermal stresses; Time measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.551419

Filename

551419