Packaging trends and mounting techniques for power surface mount components

Author

Hollander, Dave

Author_Institution

Motorola SPS, Phoenix, AZ, USA

fYear

1995

fDate

21-24 Feb 1995

Firstpage

264

Abstract

One of the fastest growing areas in surface mount is in power electronics applications such as motor control and power supplies. These applications which have been traditionally through-hole have discovered the advantages of surface mount. The increased availability of surface mount power semiconductors, new substrates and other components has many of the newer power designs converting to surface mount technology. This paper shows trends in discrete power packaging and then addresses some of the concerns that arise when using packages such as the SOT-223, DPAK, D²PAK, D³PAK, and SOIC packages. Details of these packages are discussed as well as thermal capabilities and mounting techniques as they relate to power electronics

Keywords

power semiconductor diodes; power transistors; soldering; surface mount technology; thermal analysis; D²PAK package; D³PAK package; DPAK package; SOIC package; SOT-223 package; discrete power packaging; motor control; mounting techniques; packaging trends; power electronics; power supplies; power surface mount components; solder stencils; soldering; substrates; surface mount power semiconductors; thermal capabilities; Assembly; Conductors; Diodes; Electronic packaging thermal management; Electronics packaging; MOSFETs; Power electronics; Power supplies; Printed circuits; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics and Drive Systems, 1995., Proceedings of 1995 International Conference on

Print_ISBN

0-7803-2423-4

Type

conf

DOI

10.1109/PEDS.1995.404911

Filename

404911