Title :
Challenges in designing high speed memory subsystem for mobile applications
Author :
Yip, Tsunwai Gary ; Yeung, Philip ; Li, Ming ; Dressler, Deborah
Author_Institution :
Semicond. Bus. Group, Rambus Inc., Sunnyvale, CA, USA
Abstract :
Some constraints imposed on the design of components for mobile devices are the size of the handheld device, safety for handling, heat dissipation, and in-system electromagnetic interference. This paper discusses challenges in designing the next generation low power DRAM subsystem operating at multi-gigabits per second. A new mobile DRAM interface that can meet the challenges and some test data are presented.
Keywords :
mobile computing; random-access storage; handheld device; heat dissipation; high speed memory subsystem; in-system electromagnetic interference; low power DRAM subsystem; mobile DRAM interface; mobile applications; mobile devices; Heating; Mobile communication; Power demand; Random access memory; Smart phones; Thermal resistance; EM emission; high data rate; low power DRAM; mobile phone; package-on-package; thermal;
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2011
Conference_Location :
Grenoble
Print_ISBN :
978-1-61284-208-0
DOI :
10.1109/DATE.2011.5763090
