Title :
Beam test results of new pixel sensors bump-bonded to the ALICE pixel front-end chip
Author :
Santoro, Romualdo
Author_Institution :
Phys. Dept. Bari, CERN, Bari, Italy
Abstract :
The test beam carried out at the CERN SPS with a 3D and an epitaxial silicon sensor bump-bonded to the ALICE pixel front-end chip is described in this paper. Both sensors are prototypes fabricated at FBK: the 3D is a Double-Sided Double-Type Column (DDTC) sensor while the epitaxial is planar and has been thinned to 100 μm thickness by VTT during the flip-chip bonding process. Some very preliminary results on the detector performance are presented.
Keywords :
elemental semiconductors; flip-chip devices; semiconductor counters; silicon; ALICE pixel front-end chip; CERN SPS; DDTC sensor; VTT; double-sided double-type column; epitaxial silicon sensor bump-bond; flip-chip bonding process; pixel sensors; Detectors; Epitaxial growth; Silicon; Telescopes; Three dimensional displays;
Conference_Titel :
Advances in Sensors and Interfaces (IWASI), 2011 4th IEEE International Workshop on
Conference_Location :
Savelletri di Fasano
Print_ISBN :
978-1-4577-0623-3
Electronic_ISBN :
978-1-4577-0622-6
DOI :
10.1109/IWASI.2011.6004711
