MEMS switch for wireless communication circuits: fabrication process and simulation

Author

Kretly, L.C. ; Tavora, A.A.S. ; Capovilla, C.E.

Author_Institution

DMO-UNICAMP, Campinas, Brazil

fYear

2005

fDate

25-28 July 2005

Firstpage

427

Lastpage

429

Abstract

This paper describes the process and methodology adopted for the design of a MEMS (micro electro mechanical system) switch in coplanar microstrip lines. The design proposed in this paper is the metallic bridge over a coplanar microstrip line suspended in both sides by two metallic posts. These MEMS switches are designed for operation at S band satisfying the implementation requirements for Bluetooth and WLAN systems giving the possibility of operation in two protocols: IEEE 802.11b up to 11 Mb/s bit rate (commonly named Wi-Fi) and 802.11g up to 54 Mb/s, recently approved with significant rise in data rate when compared to the 802.11b. The S parameters and electromechanical displacement simulations are also presented.

Keywords

Bluetooth; S-parameters; microstrip lines; microswitches; microwave switches; wireless LAN; Bluetooth; IEEE 802.11b; MEMS switch; S band; S parameters; WLAN systems; coplanar microstrip lines; electromechanical displacement; fabrication process; micro electro mechanical system; wireless communication circuits; Bridge circuits; Circuit simulation; Communication switching; Fabrication; Mechanical systems; Micromechanical devices; Microstrip; Microswitches; Switches; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Optoelectronics, 2005 SBMO/IEEE MTT-S International Conference on

Print_ISBN

0-7803-9341-4

Type

conf

DOI

10.1109/IMOC.2005.1580035

Filename

1580035