DocumentCode :
3083034
Title :
Efficient modeling and analysis of multilayered power distribution network by using conformal mesh and block-type leapfrog scheme
Author :
Sekine, Taku ; Asai, Hiroki
Author_Institution :
Dept. of Mech. Eng., Shizuoka Univ., Hamamatsu, Japan
fYear :
2013
fDate :
12-15 Dec. 2013
Firstpage :
221
Lastpage :
224
Abstract :
This paper describes an efficient modeling technique based on a conformal mesh and its application to a fast transient analysis using a block-type leapfrog scheme for the simulations of multilayered power distribution networks (PDNs). Compared with conventional rectangular and triangular mesh generations, the conformal mesh approach can provide fewer meshes by using subcells. As a result, the number of the circuit elements constituting an equivalent circuit model becomes much fewer than those of the conventional models. In addition, the topology of the circuit is suitable for the bock latency insertion method (block-LIM), which is based on the explicit time marching procedure in a leapfrog manner. Example simulations of a multilayered PDN with nonorthogonal contours and fine structures show that the proposed conformal modeling combined with the block-LIM is as accurate as and much more efficient than the conventional modeling techniques with a SPICE-like circuit solver.
Keywords :
equivalent circuits; printed circuit interconnections; printed circuit testing; transient analysis; SPICE-like circuit solver; block latency insertion method; block-LIM; block-type leapfrog scheme; conformal mesh; equivalent circuit model; explicit time marching procedure; fast transient analysis; multilayered PDN; multilayered power distribution networks; nonorthogonal contours; rectangular mesh generations; subcells; triangular mesh generations; Conductors; Dielectrics; Equivalent circuits; Finite difference methods; Integrated circuit modeling; Shape; Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE
Conference_Location :
Nara
Print_ISBN :
978-1-4799-2313-7
Type :
conf
DOI :
10.1109/EDAPS.2013.6724429
Filename :
6724429
Link To Document :
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