DocumentCode :
3083098
Title :
A comparison of equivalent circuit models of power/ground planes based on Delaunay triangulation in transient analysis
Author :
Watanabe, Toshio ; Asai, Hiroki
Author_Institution :
Res. Center for ICT Innovation, Univ. of Shizuoka, Shizuoka, Japan
fYear :
2013
fDate :
12-15 Dec. 2013
Firstpage :
233
Lastpage :
236
Abstract :
In this paper, two types of equivalent circuit models, the D-model and the V-model, of power/ground planes are compared for the transient simulation. While both models are led from the Delaunay triangulation, they are different in that capacitances of the D-model and the V-model are calculated at the Delaunay triangles and the polygons of the Voronoi tessellation, respectively. The two models are compared in terms of the computation efficiency and the memory usage in the transient simulation. The advantages and disadvantages by a combination of the models and the transient simulation algorithms, including the SPICE and the latency insertion method (LIM), are discussed. Examples show that the V-model has advantages over the D-model in the SPICE simulation. On the other hand, the time-step size of the D-model tends to be very small compared with the V-model in the latency insertion method, because tiny inductances are often produced in the D-model.
Keywords :
SPICE; equivalent circuits; integrated circuit modelling; mesh generation; transient analysis; D-model; Delaunay triangles; Delaunay triangulation; SPICE simulation; V-model; Voronoi tessellation; equivalent circuit models; latency insertion method; memory usage; power/ground planes; time-step size; transient analysis; transient simulation; Computational modeling; Equivalent circuits; Inductors; Integrated circuit modeling; Numerical models; SPICE; Transient analysis; Delaunay Triangulation; LIM; PDN; SPICE; power integrity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE
Conference_Location :
Nara
Print_ISBN :
978-1-4799-2313-7
Type :
conf
DOI :
10.1109/EDAPS.2013.6724432
Filename :
6724432
Link To Document :
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