DocumentCode :
3083201
Title :
Design of crosstalk compensation passive equalizers for high-speed differential signaling on 2.5D-IC interposer
Author :
Sumin Choi ; Heegon Kim ; Sukjin Kim ; Jung, Daniel H. ; Joungho Kim ; Junho Lee ; Kunwoo Park
Author_Institution :
Dept. Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
fYear :
2013
fDate :
12-15 Dec. 2013
Firstpage :
253
Lastpage :
256
Abstract :
In this paper, crosstalk compensation equalizers for high-speed differential signaling on the silicon-based interposer were proposed. By compensating the amount of crosstalk on each metal line of the victim differential pair, crosstalk can be rejected for common noise of the differential signaling. To design crosstalk compensation passive equalizers, Metal-Insulator-Metal (MIM) capacitor is connected between an aggressor metal line and a further victim metal line which makes same capacitive crosstalk on a victim differential pair. In other way of design equalizer, Twisted Differential Lines is also proposed to make same crosstalk on a victim differential pair to be eliminated as common noise rejection. These equalizers result in the wide-band channel equalization. The effective performances of these passive equalizers are designed by Full EM Simulation tool and successfully demonstrated and verified. S parameter, output signal voltage, and eye-diagrams of Far-end Crosstalk (FEXT) are analyzed in frequency and time domain.
Keywords :
MIM devices; S-parameters; capacitors; crosstalk; elemental semiconductors; equalisers; high-speed integrated circuits; integrated circuit interconnections; silicon; 2.5D-IC interposer; FEXT; S-parameter; aggressor metal line; common noise rejection; crosstalk compensation passive equalizers; eye diagrams; far end crosstalk; full EM simulation tool; high-speed differential signaling; integrated circuits; metal-insulator-metal capacitor; silicon-based interposer; twisted differential lines; victim differential pair; victim metal line; wideband channel equalization; Bandwidth; Crosstalk; Equalizers; MIM capacitors; Metals; Noise; Silicon; Common noise rejection; Crosstalk; Differential signaling; Metal-Insulator-Metal capacitor; On-interposer; Passive equalizer; Twisted Differential Lines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE
Conference_Location :
Nara
Print_ISBN :
978-1-4799-2313-7
Type :
conf
DOI :
10.1109/EDAPS.2013.6724437
Filename :
6724437
Link To Document :
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