• DocumentCode
    3083201
  • Title

    Design of crosstalk compensation passive equalizers for high-speed differential signaling on 2.5D-IC interposer

  • Author

    Sumin Choi ; Heegon Kim ; Sukjin Kim ; Jung, Daniel H. ; Joungho Kim ; Junho Lee ; Kunwoo Park

  • Author_Institution
    Dept. Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
  • fYear
    2013
  • fDate
    12-15 Dec. 2013
  • Firstpage
    253
  • Lastpage
    256
  • Abstract
    In this paper, crosstalk compensation equalizers for high-speed differential signaling on the silicon-based interposer were proposed. By compensating the amount of crosstalk on each metal line of the victim differential pair, crosstalk can be rejected for common noise of the differential signaling. To design crosstalk compensation passive equalizers, Metal-Insulator-Metal (MIM) capacitor is connected between an aggressor metal line and a further victim metal line which makes same capacitive crosstalk on a victim differential pair. In other way of design equalizer, Twisted Differential Lines is also proposed to make same crosstalk on a victim differential pair to be eliminated as common noise rejection. These equalizers result in the wide-band channel equalization. The effective performances of these passive equalizers are designed by Full EM Simulation tool and successfully demonstrated and verified. S parameter, output signal voltage, and eye-diagrams of Far-end Crosstalk (FEXT) are analyzed in frequency and time domain.
  • Keywords
    MIM devices; S-parameters; capacitors; crosstalk; elemental semiconductors; equalisers; high-speed integrated circuits; integrated circuit interconnections; silicon; 2.5D-IC interposer; FEXT; S-parameter; aggressor metal line; common noise rejection; crosstalk compensation passive equalizers; eye diagrams; far end crosstalk; full EM simulation tool; high-speed differential signaling; integrated circuits; metal-insulator-metal capacitor; silicon-based interposer; twisted differential lines; victim differential pair; victim metal line; wideband channel equalization; Bandwidth; Crosstalk; Equalizers; MIM capacitors; Metals; Noise; Silicon; Common noise rejection; Crosstalk; Differential signaling; Metal-Insulator-Metal capacitor; On-interposer; Passive equalizer; Twisted Differential Lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE
  • Conference_Location
    Nara
  • Print_ISBN
    978-1-4799-2313-7
  • Type

    conf

  • DOI
    10.1109/EDAPS.2013.6724437
  • Filename
    6724437