Title :
Wireless power distribution network for 3D package using magnetic field resonance
Author :
Eunseok Song ; Hongseok Kim ; Chiuk Song ; Kim, Jonghoon J. ; Joungho Kim
Author_Institution :
Dept. of Electr. Eng., KAIST, Daejeon, South Korea
Abstract :
In this paper, a wireless power transfer (WPT) scheme using magnetic field resonances for 3D packages is proposed and a wireless power distribution network (PDN) in a WPT system is analyzed in terms of the simultaneous switching noise (SSN). For analyzing the wireless PDN impedance characteristic and the power efficiency, a ball grid array (BGA) package with a size of 35 mm×35 mm is fabricated. Also, a new schematic of the wire PDN is defined to analyze a WPT system applied to the WPT system in terms of SSN. The impedance (Z11) characteristics between the interconnection-based hierarchical PDN structure and the hierarchical PDN based on the proposed WPT scheme are compared and analyzed. The package-level WPT system proposed in this study represents excellent wireless PDN impedance characteristics in decreasing the power noise occurred in a 3D package.
Keywords :
ball grid arrays; distribution networks; inductive power transmission; integrated circuit packaging; power supply circuits; 3D package; ball grid array; interconnection-based hierarchical PDN structure; magnetic field resonance; package-level WPT system; power noise; simultaneous switching noise; size 35 mm; wireless power distribution network; wireless power transfer; Capacitors; Impedance; Inductors; Magnetic fields; Rectifiers; Three-dimensional displays; Wireless communication; 3D package; PDN-impedance; inductor design; magnetic field; power distribution network (PDN); power efficiency; resonance; simultaneous switching noise (SSN); wireless power transfer (WPT);
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE
Conference_Location :
Nara
Print_ISBN :
978-1-4799-2313-7
DOI :
10.1109/EDAPS.2013.6724450
