Advanced low cost manufacturing from CMP service

Author

Torki, Kholdoun ; Courtois, Bernard

Author_Institution

CMP Service, Grenoble, France

fYear

1999

fDate

1999

Firstpage

4

Lastpage

5

Abstract

CMP aims at providing universities, research laboratories and industries with the facility to have their integrated circuits projects fabricated for prototyping and low volume production. Presently, users are provided for CMOS double layer poly/double layer metal (DLP/DLM) 0.8 μm, DLM/TLM 0.6 μm, DLP/4LM 0.35 μm, SLP/6LM 0.25 μm, BiCMOS DLP/DLM 0.8 μm and 0.6 μm, SiGe HBT 0.8 μm DLP/DLM, and GaAs HEMT 0.2 μm about 40 multi-project runs are offered per year. Microelectromechanical systems (MEMS) are provided in standard CMP runs in CMOS DLP/DLM 0.8μm, BiCMOS DLP/DLM 0.8 μm and HEMT GaAs 0.2 μm, using compatible front-side bulk micro-machining MUMPS process is offered as a surface micro-machining allowing the integration of MEMS only microstructures. Finally, the main processes for multi-chip modules (MCMs) are also accessible through CMP

Keywords

BiCMOS integrated circuits; CMOS integrated circuits; Ge-Si alloys; III-V semiconductors; gallium arsenide; integrated circuit manufacture; micromechanical devices; multichip modules; 0.2 mum; 0.25 mum; 0.35 mum; 0.6 mum; 0.8 mum; CMOS; CMP service; GaAs; HBT; HEMT; IC projects fabrication; SiGe; double layer poly/double layer metal; iCMOS; industries; low-cost IC manufacturing; research laboratories; universities; BiCMOS integrated circuits; Costs; Educational institutions; Gallium arsenide; HEMTs; Laboratories; Manufacturing industries; Micromechanical devices; Prototypes; Textile industry;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronic Systems Education, 1999. MSE'99. IEEE International Conference on

Conference_Location

Arlington, VA

Print_ISBN

0-7695-0312-8

Type

conf

DOI

10.1109/MSE.1999.787009

Filename

787009