DocumentCode :
3083634
Title :
Mode conversion caused by discontinuity in transmission line: From viewpoint of imbalance factor and modal characteristic impedance
Author :
Toyota, Yoshitaka ; Iokibe, Kengo ; Koga, Liuji R.
Author_Institution :
Grad. Sch. of Natural Sci. & Technol., Okayama Univ., Okayama, Japan
fYear :
2013
fDate :
12-15 Dec. 2013
Firstpage :
52
Lastpage :
55
Abstract :
For treating mode conversion caused by discontinuity in multi-conductor transmission line with circuit analysis, we have proposed a modal equivalent-circuit model with mode-conversion sources. The approach takes an advantage in less calculation sources and countermeasure consideration compared with full-wave simulation. A mode-decomposition technique was applied with an imbalance factor, that is, the current division factor in our study, of the transmission line. In the modal circuit analysis we proposed, mode conversion is expressed by the controlled sources of which magnitude is proportional to the difference between the current division factors of the adjacent transmission lines. In this paper, we focused on the modal transfer power and derived the mathematical expressions of the mode conversion using the modal characteristic impedance as well as the current division factor. For validating the derived equations, in addition, the comparison with full-wave simulation was carried out and a good agreement was confirmed.
Keywords :
equivalent circuits; multiconductor transmission lines; network analysis; current division factor; full-wave simulation; imbalance factor; modal characteristic impedance; modal circuit analysis; modal equivalent circuit model; modal transfer power; mode conversion; multiconductor transmission line; Coaxial cables; Equivalent circuits; Impedance; Integrated circuit modeling; Mathematical model; Power cables; current division factor; imbalance factor; modal characteristic impedance; modal equivalent circuit; mode conversion; mode-decomposition technique;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE
Conference_Location :
Nara
Print_ISBN :
978-1-4799-2313-7
Type :
conf
DOI :
10.1109/EDAPS.2013.6724455
Filename :
6724455
Link To Document :
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