• DocumentCode
    3083634
  • Title

    Mode conversion caused by discontinuity in transmission line: From viewpoint of imbalance factor and modal characteristic impedance

  • Author

    Toyota, Yoshitaka ; Iokibe, Kengo ; Koga, Liuji R.

  • Author_Institution
    Grad. Sch. of Natural Sci. & Technol., Okayama Univ., Okayama, Japan
  • fYear
    2013
  • fDate
    12-15 Dec. 2013
  • Firstpage
    52
  • Lastpage
    55
  • Abstract
    For treating mode conversion caused by discontinuity in multi-conductor transmission line with circuit analysis, we have proposed a modal equivalent-circuit model with mode-conversion sources. The approach takes an advantage in less calculation sources and countermeasure consideration compared with full-wave simulation. A mode-decomposition technique was applied with an imbalance factor, that is, the current division factor in our study, of the transmission line. In the modal circuit analysis we proposed, mode conversion is expressed by the controlled sources of which magnitude is proportional to the difference between the current division factors of the adjacent transmission lines. In this paper, we focused on the modal transfer power and derived the mathematical expressions of the mode conversion using the modal characteristic impedance as well as the current division factor. For validating the derived equations, in addition, the comparison with full-wave simulation was carried out and a good agreement was confirmed.
  • Keywords
    equivalent circuits; multiconductor transmission lines; network analysis; current division factor; full-wave simulation; imbalance factor; modal characteristic impedance; modal circuit analysis; modal equivalent circuit model; modal transfer power; mode conversion; multiconductor transmission line; Coaxial cables; Equivalent circuits; Impedance; Integrated circuit modeling; Mathematical model; Power cables; current division factor; imbalance factor; modal characteristic impedance; modal equivalent circuit; mode conversion; mode-decomposition technique;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE
  • Conference_Location
    Nara
  • Print_ISBN
    978-1-4799-2313-7
  • Type

    conf

  • DOI
    10.1109/EDAPS.2013.6724455
  • Filename
    6724455