Using genetic algorithms to automate system implementation in a novel three-dimensional packaging technology

Implementing electronic systems in a low-cost, three-dimensional multichip module (MCM) technology provides significantly improved system density over planar packaging technologies. However, the extra dimension necessitates a new approach to design automation. Through experience gained in manually partitioning electronic systems, generic design rules have been formulated and implemented in software. The approach adopted is based on a genetic algorithm which can produce multiple candidate solutions and has the potential to simultaneously optimize multiple design criteria. This paper presents the initial results for the automatic configuration of a variety of systems. The results obtained by the algorithm are compared to known optimal solutions for “test” cases and to the results obtained by manual partitioning for the first heterogeneous MCM-V system