Development of vertical interconnect surface mount packages

Author

Hongwei Liang ; Chun, C. ; Laskar, J. ; Estriech, D.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

3

fYear

1998

fDate

7-12 June 1998

Firstpage

1819

Abstract

A novel vertical interconnect package (VIP) based upon surface mount plastic lead frame packages is presented for microwave applications. The prototype has been fabricated and measured, and its finite element method (FEM) simulation is confirmed by experimental results. This new package demonstrates improvements of approximately 10 dB in return loss and 1 dB in insertion loss over the small shrink outline package (SSOP) to 10 GHz. Investigation into the behavior of the discontinuities has provided insight into mismatches at interconnects, and higher performance prototypes are in fabrication.

Keywords

finite element analysis; plastic packaging; surface mount technology; 10 GHz; discontinuity; finite element method simulation; insertion loss; microwave packaging; mismatch; return loss; surface mount plastic lead frame package; vertical interconnect package; Costs; Insertion loss; Microwave technology; Plastic packaging; Prototypes; Radio frequency; Scattering parameters; Surface-mount technology; Transmission line measurements; Virtual prototyping;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1998 IEEE MTT-S International

Conference_Location

Baltimore, MD, USA

ISSN

0149-645X

Print_ISBN

0-7803-4471-5

Type

conf

DOI

10.1109/MWSYM.1998.700832

Filename

700832