Crosstalk and electromagnetic compatibility of copper pair building wiring systems

Crosstalk and electromagnetic compatibility are dominant causes of LAN (local area network) system limitations imposed by the copper pair medium. These are discussed, and methods for quantifying them in terms of electrical parameters observable at the wiring interfaces are presented. Methods have been developed to determine crosstalk and electromagnetic interference emission and immunity in terms of the electrical characteristics of this interface. These have significant practical advantages over alternative techniques which do not operate on the wiring interface. Tests have demonstrated that they are sufficiently accurate to be used as a basis for the development of standards to control compatibility. These measurements have confirmed that the various alternative transmission methods employed introduce quite distinct limitations. Such measurements enable the few potential sources of incompatibility which may occur to be identified and action to be taken to ensure the LANs can be interconnected successfully over unscreened twisted pair wiring