High frequency modeling of interconnects in deep-submicron technologies

Author

Cregut, Corinne ; Le Carval, Gilles ; Chilo, Jean

Author_Institution

SNAKETECH, Voiron, France

fYear

1999

fDate

1999

Firstpage

71

Lastpage

73

Abstract

In this paper, we evaluate the suitable level of modeling for interconnects in deep sub-micron circuits. We propose high frequency models for transmission lines and crosstalk. Our method is based on the association of electromagnetic (EM) and electrical simulations. We validate the principle of this method by comparisons with time domain characterizations. In particular, we analyze the role of the ground configuration in the mechanisms of crosstalk

Keywords

MMIC; crosstalk; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; transmission line theory; EM simulations; crosstalk; crosstalk mechanisms; electrical simulations; electromagnetic simulations; ground configuration; high frequency modeling; high frequency models; interconnect modeling; interconnects; time domain characterization; transmission lines; Circuit simulation; Circuit testing; Computational modeling; Crosstalk; Dielectric substrates; Distributed parameter circuits; Frequency; Integrated circuit interconnections; RLC circuits; Transmission line measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology, 1999. IEEE International Conference

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-5174-6

Type

conf

DOI

10.1109/IITC.1999.787082

Filename

787082