• DocumentCode
    3085114
  • Title

    Design methodologies for tolerating cell and interconnect faults in FPGAs

  • Author

    Hanchek, Fran ; Dutt, Shantanu

  • Author_Institution
    Intel Corp., Hillsboro, OR, USA
  • fYear
    1996
  • fDate
    7-9 Oct 1996
  • Firstpage
    326
  • Lastpage
    331
  • Abstract
    Significant increases in chip yield can result if faulty logic cells and wiring in field programmable gate arrays (FPGAs) can be isolated from the remainder of the circuitry to retain a completely usable chip. Utilizing the principle of node-covering, a routing discipline has been developed that allows each logic cell in an FPGA to cover-to be able to replace-its neighbor in a row. An FPGA is factory-reconfigured such that a faulty cell is replaced by its cover, which in turn is replaced by its own cover, and so on until a spare cell in the row is reached. Since wiring channel area is a major portion of chip area in an FPGA, new techniques are also proposed for tolerating wiring faults. As with faulty logic cells, faulty wiring portions are replaced by adjacent ones, until eventually a spare wiring portion is reached. Compared to other techniques for fault tolerance in FPGAs, these methods are shown to provide significantly greater yield improvement
  • Keywords
    fault tolerant computing; field programmable gate arrays; FPGAs; cell faults; chip yield; completely usable chip; design methodologies; fault tolerance; faulty logic cells; field programmable gate arrays; interconnect faults; wiring; wiring channel area; Circuit faults; Design methodology; Field programmable gate arrays; Integrated circuit interconnections; Logic arrays; Production facilities; Programmable logic arrays; Reconfigurable logic; Routing; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design: VLSI in Computers and Processors, 1996. ICCD '96. Proceedings., 1996 IEEE International Conference on
  • Conference_Location
    Austin, TX
  • ISSN
    1063-6404
  • Print_ISBN
    0-8186-7554-3
  • Type

    conf

  • DOI
    10.1109/ICCD.1996.563574
  • Filename
    563574