Title :
Thermal decomposition of low-k pulsed plasma fluorocarbon films
Author :
Cruden, Brett ; Chu, Karen ; Gleason, Karen ; Sawin, Herbert
Author_Institution :
MIT, Cambridge, MA, USA
Abstract :
Low-k fluorocarbon films have been deposited by pulsed plasma chemical vapor deposition (CVD) and their thermal stabilities have been examined. We have observed and identified at least two mechanisms for thermal decomposition. We have been able to eliminate the most labile decomposition route by increasing substrate temperature during deposition. Enhanced decomposition due to ex-situ oxygen exposure has also been observed
Keywords :
dielectric thin films; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; integrated circuit testing; organic compounds; plasma CVD; pyrolysis; thermal stability; O2; decomposition; ex-situ oxygen exposure; labile decomposition route; low-k fluorocarbon films; low-k pulsed plasma fluorocarbon films; pulsed PECVD; pulsed plasma chemical vapor deposition; substrate temperature; thermal decomposition; thermal decomposition mechanisms; thermal stability; Dielectric thin films; Electrodes; Optical films; Plasma chemistry; Plasma properties; Plasma stability; Plasma temperature; Thermal decomposition; Thermal stability; Thin film devices;
Conference_Titel :
Interconnect Technology, 1999. IEEE International Conference
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-5174-6
DOI :
10.1109/IITC.1999.787107
